SINELEC Conductive Compounds - PP
|
Compound Reference |
Units
|
CCB1861
LLDPE |
CCB1834
PP |
CCB6814
PP |
CCB6824
PP |
Test Method
|
|
Mechanical
Properties
|
||||||
| Tensile Strength @ Yield-Transverse/Longitudinal |
MPa
|
21/31
|
25
|
35
|
25
|
ASTM D-638
|
| Elongation @ break- Transverse/Longitudinal |
%
|
> 600/500
|
-
|
64
|
40
|
ASTM D-638
|
| Notched Izod Impact @23°C |
J/M
|
-
|
300
|
173
|
193
|
ASTM D-256
|
|
Flexural Strength |
MPa
|
-
|
28
|
35
|
26
|
ASTM D-790
|
|
Flexural Modulus |
MPa
|
-
|
1100
|
1400
|
1000
|
ASTM D-790
|
|
Thermal
Property
|
||||||
|
Heat
Deflection Temperature
|
°C
|
-
|
-
|
-
|
-
|
-
|
| @ 0.46N/M2 |
-
|
98
|
110
|
105
|
ASTM D-648
|
|
| Vicat Softening Point, 1kg |
°C
|
-
|
151
|
154
|
150
|
ASTM D-1525
|
|
Physical
Properties
|
||||||
|
Specific Gravity |
g/cc |
1.0
|
1.01
|
0.96
|
1.5
|
ASTM D792
|
|
Melt Flow Index |
||||||
|
@ 230°C/2.16KG
|
g/10 min |
-
|
5.6
|
0.5
|
1.5
|
ASTM D1238
|
|
@ 230°C/5KG
|
g/10 min |
-
|
1.4
|
-
|
-
|
ASTM D1238
|
|
@ 190°C/10KG
|
g/10
min
|
3.0
|
-
|
-
|
-
|
ASTM D1238
|
|
Shrinkage
|
%
|
-
|
1.2-1.4
|
-
|
-
|
ASTM D955
|
|
Electrical
Property
|
||||||
| Surface Resistivity |
ohm |
<1x105
|
<1x105
|
<1x105
|
<1x105
|
-
|
| Volume Resistivity |
ohm-cm |
<1x105
|
<1x105
|
<1x105
|
<1x105
|
-
|
| Application |
-
|
Blown film for packaging
|
Injection
Moulding
|
Corrugated sheet extrusion & injection
|
Injection Moulding
|
-
|
Singapore Polymer Corporation Pte Ltd reserves the right to change its products any time. Data provided in this web publication may not always be updated. Information provided herein is for general information and is given in good faith. Specific technical information and directives must be obtained from our representatives before using our products, to determine the suitability for any particular use. No warranty is given nor is to be implied with respect to information given herein. Values presented are typical and intended to serve as guides only, and should not be considered as limits to the specifications. Freedom under patents, copyright and registered designs cannot be assumed.